XIX Chilean Congress of Mechanical Engineering
COCIM2026
A leading space for the dissemination of applied science and technology, bringing together researchers, academics, professionals, and students in the field.
Engineering Research and Development
The XIX Chilean Congress of Mechanical Engineering (COCIM 2026) is organized by the University of Santiago, Chile (USACH).
The meeting fosters technical interaction through papers reviewed by a scientific committee, guaranteeing the rigor and validation of contributions in the official congress proceedings.
Scientific Review
Peer review of abstracts.
Official Venue
Department of Mechanical Engineering.
Plenary Sessions
Dr. Henry A. Colorado Lopera
Universidad de Antioquia, Colombia
Full Professor of Engineering at the Universidad de Antioquia in Medellín, Colombia, where he has led the CCComposites Laboratory since 2013. A globally collaborative researcher with active visiting affiliations in Brazil and recently a Fulbright Visiting Scholar at the University of California, San Diego. His core research focuses on composite materials, natural fibers, green materials, and additive manufacturing, with over 200 publications (H-index > 50). He earned his Ph.D. in Materials Science and Engineering from UCLA and was honored with the 2026 Distinguished Scientist/Engineer Award (TMS) and recognized as a Global Ambassador by The American Ceramic Society (ACerS).
Dra. Viviana Meruane
Universidad de Chile, Chile
Full Professor in the Department of Mechanical Engineering at the University of Chile and Director of R&D at the AI startup Calmly. She received her Ph.D. in Engineering from KU Leuven (Belgium). Her research focuses on mechanical vibrations, condition monitoring, fault diagnosis and prognosis, artificial intelligence for engineering, and predictive maintenance. She has led numerous research and technology transfer projects in collaboration with industry and has an extensive international scientific publication record. Her distinctions include the Justicia Acuña Mena Award from the Chilean Institute of Engineers, recognition as one of Chile’s 100 Leading Women, and inclusion among the world’s top 2% most influential researchers in the field of acoustics.
Technical Lines
Solid Mechanics
Stress analysis, strain, elasticity, plasticity, and fracture mechanics in deformable solids.
Fluid Mechanics
Theoretical and experimental fluid dynamics, aerodynamics, multiphase flows, and turbomachinery.
Thermal Engineering and Energy
Applied thermodynamics, heat transfer, energy efficiency and renewable power systems.
Computational Mechanics
Mathematical modeling, finite element analysis (FEA) and computational fluid dynamics (CFD).
Design and Manufacturing
Integration of CAD/CAM methodologies, advanced machining processes and structural tolerance.
Advanced Materials
Microstructural characterization, nanomaterials, metallurgy and mechanical failure analysis.
Mechatronics, Robotics and Automation
Industrial control systems, kinematics, advanced mechatronics, sensors integration and intelligent algorithms.
AI applied to Mechanical Engineering
Machine learning, neural networks and algorithmic optimization in mechanical systems.
Transport and Mobility
Automotive design, vehicle dynamics, aerospace systems and electromobility.
Biomaterials, Biomechanics, and Mechanobiology
Biophysical analysis of tissues and biofabricated materials.
Innovation and Development
R&D projects, technology transfer, patenting and industrial prototyping.
Education and Innovation in Engineering
New teaching methodologies, virtual laboratories and curricular innovation.
Timeline
Abstract Submission
Structured abstract
Acceptance Notification
Official confirmation
Full Paper Submission
Full Paper for proceedings
Registration Payment
Payment deadline
Final Approval
Presentation program definition
Congress Start
Registration opening and talks
Call for Papers
Submit your proposal through our official congress management platform:
Submission PlatformTechnical questions or inquiries?
cocim2026@usach.clFees
| Category | Fee (CLP) |
|---|---|
| Academics / Researchers (Maximum two papers per author) | $160.000 |
| Students (Maximum one paper per author) | $45.000 |
For payment or billing inquiries, contact: cocim2026@usach.cl
Main Venue
The technical sessions of the congress will take place in the VIME USACH auditoriums and the Department of Mechanical Engineering.
Address
Las Sophoras 175, Estación Central, Santiago
Connectivity
Line 1 - Estación Central.
Contact
cocim2026@usach.clOfficial Sponsor
Technological and institutional support for the development of engineering simulations.