Máquina Biaxial de Ensayos Mecánicos
University of Santiago, Chile

XIX Chilean Congress of Mechanical Engineering

COCIM2026

November 18th - 20th, 2026
Deadline for Abstract Submission
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A leading space for the dissemination of applied science and technology, bringing together researchers, academics, professionals, and students in the field.

General Information

Engineering Research and Development

The XIX Chilean Congress of Mechanical Engineering (COCIM 2026) is organized by the University of Santiago, Chile (USACH).

The meeting fosters technical interaction through papers reviewed by a scientific committee, guaranteeing the rigor and validation of contributions in the official congress proceedings.

Scientific Review

Peer review of abstracts.

Official Venue

Department of Mechanical Engineering.

Official Poster COCIM 2026 Poster
View or Download Flyer

Click on the image to access the diffusion document.

International Speakers

Plenary Sessions

Dr. Henry A. Colorado Lopera

Dr. Henry A. Colorado Lopera

Universidad de Antioquia, Colombia

Full Professor of Engineering at the Universidad de Antioquia in Medellín, Colombia, where he has led the CCComposites Laboratory since 2013. A globally collaborative researcher with active visiting affiliations in Brazil and recently a Fulbright Visiting Scholar at the University of California, San Diego. His core research focuses on composite materials, natural fibers, green materials, and additive manufacturing, with over 200 publications (H-index > 50). He earned his Ph.D. in Materials Science and Engineering from UCLA and was honored with the 2026 Distinguished Scientist/Engineer Award (TMS) and recognized as a Global Ambassador by The American Ceramic Society (ACerS).

Dra. Viviana Meruane

Dra. Viviana Meruane

Universidad de Chile, Chile

Full Professor in the Department of Mechanical Engineering at the University of Chile and Director of R&D at the AI startup Calmly. She received her Ph.D. in Engineering from KU Leuven (Belgium). Her research focuses on mechanical vibrations, condition monitoring, fault diagnosis and prognosis, artificial intelligence for engineering, and predictive maintenance. She has led numerous research and technology transfer projects in collaboration with industry and has an extensive international scientific publication record. Her distinctions include the Justicia Acuña Mena Award from the Chilean Institute of Engineers, recognition as one of Chile’s 100 Leading Women, and inclusion among the world’s top 2% most influential researchers in the field of acoustics.

Thematic Axes

Technical Lines

Solid Mechanics

Stress analysis, strain, elasticity, plasticity, and fracture mechanics in deformable solids.

Fluid Mechanics

Theoretical and experimental fluid dynamics, aerodynamics, multiphase flows, and turbomachinery.

Thermal Engineering and Energy

Applied thermodynamics, heat transfer, energy efficiency and renewable power systems.

Computational Mechanics

Mathematical modeling, finite element analysis (FEA) and computational fluid dynamics (CFD).

Design and Manufacturing

Integration of CAD/CAM methodologies, advanced machining processes and structural tolerance.

Advanced Materials

Microstructural characterization, nanomaterials, metallurgy and mechanical failure analysis.

Mechatronics, Robotics and Automation

Industrial control systems, kinematics, advanced mechatronics, sensors integration and intelligent algorithms.

AI applied to Mechanical Engineering

Machine learning, neural networks and algorithmic optimization in mechanical systems.

Transport and Mobility

Automotive design, vehicle dynamics, aerospace systems and electromobility.

Biomaterials, Biomechanics, and Mechanobiology

Biophysical analysis of tissues and biofabricated materials.

Innovation and Development

R&D projects, technology transfer, patenting and industrial prototyping.

Education and Innovation in Engineering

New teaching methodologies, virtual laboratories and curricular innovation.

Planning

Timeline

Abstract Submission

Structured abstract

July 30th

Acceptance Notification

Official confirmation

August 30th

Full Paper Submission

Full Paper for proceedings

October 15th

Registration Payment

Payment deadline

October 15th

Final Approval

Presentation program definition

October 30th

Congress Start

Registration opening and talks

November 18th to 20th
Call for Papers

Call for Papers

Submit your proposal through our official congress management platform:

Submission Platform

Technical questions or inquiries?

cocim2026@usach.cl
Inscriptions

Fees

Category Fee (CLP)
Academics / Researchers (Maximum two papers per author) $160.000
Students (Maximum one paper per author) $45.000

For payment or billing inquiries, contact: cocim2026@usach.cl

Location

Main Venue

The technical sessions of the congress will take place in the VIME USACH auditoriums and the Department of Mechanical Engineering.

Address

Las Sophoras 175, Estación Central, Santiago

Connectivity

Line 1 - Estación Central.

Technological Support

Official Sponsor

Technological and institutional support for the development of engineering simulations.

Logo Facultad de Ingeniería USACH Institutional Support
Logo ESSS Main Sponsor
Logo Ansys Official Software